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Summary of major events in semiconductor industry in 2020

Feb,06,2023 << Return list

January

·At the beginning of 2020, with the large-scale outbreak of the epidemic in the world, all industries fell into a state of depression, including the semiconductor industry. The entire industry was covered with a deeply depressing gray yarn.

·Gartner announced in January the revenue ranking of global semiconductor companies in 2019. The top three were Intel, Samsung and SK Hynix. In 2019, the global semiconductor revenue totaled $418.3 billion, down 11.9% year on year.

February

·The domestic semiconductor market still has huge development space, and the market is generally optimistic about SMIC International and Huahong Semiconductor. These two semiconductor enterprises have become domestic industry leaders after years of development. How to strengthen China's semiconductor manufacturing, "de-Americanization" has become an urgent problem to be solved in China.

·The COVID-19 broke out on a large scale in Japan and South Korea, which are key regions of semiconductor manufacturing industry. Both Samsung and SK Hynix have confirmed cases of employees, but they have not caused serious impact on the production line.

March

·With the construction of new infrastructure such as 5G in China, the technology and production capacity of 5G chips have been greatly improved. Therefore, the third generation of semiconductors as the key has received unprecedented attention. The third generation of semiconductor materials can meet the new requirements of modern society for high temperature, high power, high voltage, high frequency and radiation resistance, and it has economic and environmental benefits such as small size, less pollution and low operating loss. Therefore, the third generation of semiconductor materials is gradually becoming the focus of development.

·Core based semiconductors have made major breakthroughs in the field of the third generation semiconductor material "gallium nitride", which can be used for the preparation of electronic power devices and microwave RF devices.

April

·The domestic semiconductor manufacturing industry has gradually recovered its capacity, and the industry has gradually ushered in the dawn.

·Several semiconductor companies disclosed their quarterly reports, and their operating income increased. According to the analysis of Founder Securities Research Report, the semiconductor industry is divided into three echelons according to the technical level, global competitiveness and localization progress of the subdivided fields:

The first echelon: targets, packaging substrates, CMP polishing materials, wet electronic chemicals, and some packaging materials.

The second echelon: silicon wafer, electronic gas, compound semiconductor, mask.

Third gradient: photoresist.

May

·SMIC International has obtained two major state-level investment funds, the National Integrated Circuit Fund II and the Shanghai Integrated Circuit Fund II, and has invested 1.5 billion and 750 million US dollars respectively for SMIC International, with a total amount of about 16 billion yuan, which will be used for the production of domestic companies at 14 nm and below in SMIC South.

·The sales of Huawei HiSilicon increased by 54% year on year, increasing by 935 million US dollars to 2.67 billion US dollars from the previous quarter. Therefore, Huawei HiSilicon entered the top 10 list of global semiconductors for the first time.

·TSMC invested $12 billion to build a chip factory in Arizona, USA. The factory will create 1600 jobs and produce the most sophisticated 5-nanometer chip.

June

·The China Securities Regulatory Commission's Listed Company Merger and Reorganization Review Committee held its 25th working meeting in 2020. The review results showed that Wentai Technology's acquisition of the remaining equity of Nexperia was unconditionally approved. The merger of Wentai Technology and Anxiesemiconductor was the largest semiconductor acquisition case in the history of A-share.

·TSMC announced that it will start trial production of 3nm process chips in 2021 and plan to start mass production in 2022, and will increase R&D investment and purchase two advanced EUV lithography machines to accelerate the research and development of 2nm process chips.

July

·India decided to move Huawei out of the 5G network construction plan. In the same month, the UK also officially announced its decision to stop using Huawei equipment in 5G construction.

·NVIDIA's share price rose, with a total market value of about $251.314 billion, overtaking Intel as the largest chip company in the United States for the first time.

·American analog chip giant ADI successfully acquired its competitor Maxim.

·SMIC International was listed on the Science and Technology Innovation Board of Shanghai Stock Exchange on July 16! The issue price was 27.46 yuan/share, the opening price was 95 yuan/share, the total share capital was 7.13642 billion shares, the P/E ratio was 109.25 times, and the initial listing soared by more than 246%.

August

·The State issued Several Policies to Promote the High-quality Development of Integrated Circuit Industry and Software Industry in the New Era. In order to encourage the development of integrated circuit industry and software industry, the policy proposes to formulate and introduce policies and measures in eight aspects: finance and taxation, investment and financing, research and development, import and export, talent, intellectual property, market application, and international cooperation.

·Yu Chengdong, CEO of Huawei's consumer business, said that the production of Huawei's Kirin chip would be stopped on September 15 at the China Information Technology Hundred People Conference.

·SMIC 14nm has entered the mass production stage, and the yield is steadily climbing.

·At the end of August, Japanese Prime Minister Shinzo Abe resigned due to physical reasons, and Abe's tenure had an important impact on Japan's semiconductor industry.

September

·TSMC will cooperate with six universities in Taiwan to open the "TSMC Semiconductor Program".

·NVIDIA released RTX 30 series graphics card at the beginning of this month. In the same month, NVIDIA acquired ARM (excluding IoT service department) from Softbank with US $40 billion (about 273.3 billion yuan).

·The United States is about to remove Huawei ZTE equipment. The FCC said that if it wants to remove or replace Huawei and ZTE equipment, it is expected to cost 1.837 billion dollars.

October

·The first chip university in China, "Nanjing University of Integrated Circuits", was officially established. It is a special "school" set up by the government. It mainly enrolls Chinese young people who have employment needs in senior and graduate schools. The purpose is to train Chinese professional integrated circuit talents.

·Meng Wei, the spokesman of the National Development and Reform Commission, responded to the uncompleted chip project at the regular press conference, saying that "some places do not have enough understanding of the laws of the development of integrated circuits, blindly go on projects, and the risk of low-level repetitive construction appears, and even there are individual projects with construction stagnation and vacant factory buildings, resulting in a waste of resources."

·Huawei Mate40, officially released, is Huawei's first model with a 5nm technology chip. This chip is "Kirin 9000".

·The semiconductor giant AMD officially announced that the company has reached a final agreement with the FPGA chip leader Sirius, agreeing to AMD's acquisition of Sirius by issuing shares with a total value of $35 billion.

November

·Biden won the US presidential election and Trump failed to re-election. Before that, the Trump government severely suppressed the Chinese semiconductor industry, so the semiconductor manufacturer TSMC will not be able to manufacture advanced chips for Huawei HiSilicon.

·Huawei officially sold its glory at 100 billion yuan.

·Intel announced the acquisition of SigOpt, a San Francisco-based start-up whose main business is to create an optimization platform for modeling and simulation. It is reported that the technology developed by this company will help promote the development of Intel lAI chip business.

December

·The United States Department of Commerce has listed 59 Chinese enterprises, including China's largest chipmaker SMIC International, in the "entity list" to carry out export "control" to the United States. SMIC International responded that the regulation had no significant adverse impact on the company's operation and financial situation in the short term, and had a significant adverse impact on the R&D and capacity construction of advanced technology at 10nm and below.

·There are currently about 244000 chip-related enterprises in China. More than 85% of relevant enterprises are distributed in information transmission, software and information technology services, wholesale and retail, and scientific research and technology services. More than 20000 chip-related enterprises have patents.